Metal Backed PTFE / Micorowave Circuits:

  • Pre-bonded and post-bonded materials
  • Metals include Aluminum, Copper, Brass, Aluminum Composites
  • Thermally and electrically conductive and non-conductive proprietary and commercially available adhesive bonded laminates
  • Plated through hole capability metal carrier to PTFE
  • Single, Double Sided & Multilayer PTFE PCB’s
  • Precision pocket machining
  • Heat Sink Technology
  • Thin dielectric films
  • Any type of wire bondable finishes
  • In-house plating and precision machining for finished assemblies
  • Aluminum Composites : On Time Circuits Inc. makes PCBs with unique aluminum composite materials to match the coefficient of thermal expansion (CTE) for various heat generating devices. These materials can match the CTE of ceramics, transistor packages and PCBs. This gives greater flexibility in designs to use lightweight materials and meet challenging environmental requirements.