Min. Distance of Plated Hole to internal Trace or Plane .0075″
Min. Distance of Non-Plated Hole to internal Trace or Plane: Internal: .0075″, External .006″
Standard finished Minimum Annular Ring is .001″, if not specified.
Min. Pad to Drill Hole Size: Internal .010″, External .008″
Min. Plane Clearance to Drill Hole: .020″
Min. Drilled Hole Size: .008″
Drilling & Plating
RF Telecommunication (500 MHz to 100 GHz) Complex board shapes fabricated using CNC routing, milling Machining tolerances: ±.005″, down to ±.001″ Aluminum-backed PTFE circuit with nickel and gold plating on both copper circuitry and aluminum
Single and double-sided circuits with thermally conducting electrically insulating bonding film between circuitry and heat sink base. Copper circuitry with various Cu thicknesses and final finish can be bonded with Al of various types and thickness. For heat management applications: Power supplies, Automotive electronics including LEDs, Computers, Motor controls, and Power semiconductors