Everyday Volume Capability
- Layers (1-14)
- Lines and Spaces 3mil line / 3mil space
- Panel Thickness <= 250 mils
- Controlled Impedance +/- 10%
- All types of final finishes available
- Blind and Buried Vias
- Heat Sink Technology
- High Performance and Emerging Technology Materials
- Sequential Lamination
- Conductive and Non-Conductive Via Fill and Planerization
- BGA
- Ultra-Fine Pitch
- Minimum core thickness: .003
- Maximum layer count: 14
- Minimum multi-layer thickness: .025″
- Maximum multi-layer thickness (non-HASL): .015″
- Maximum multi-layer thickness (HASL): .0170″
- Blind/buried vias – sequential lamination
- Design and Verification of impedance control
- Pre-CAM DRC Analysis
- CAM-controlled Panelization with DFM
- Extracted Net-list Comparison
- Lead free alternative High Tg laminates : – Example, Isola 370HR, 185HR, Iteq 180, Ventec VT47, Grace GA170
- All Teflon (Rogers, Taconic, Arlon, Nelco)
- Standard FR4, FR406, FR408, BT, Cyanate Esters
- Polyimides
- GETEK ⁄ Megtron ⁄ Nelco-13
- Ceramic of various types
- Inner layer maximum Cu weight : 4oz
- Outer layer maximum Cu weight : 8oz
- Minimum Cu weight : 1/4 oz
ETCHING
Minimum Conductor Width :
| Start Cu Foil weight | Internal | External |
|---|---|---|
| 0.5 oz. | .003″ | .004″ |
| 1.0 oz. | .004″ | .005″ |
| 2.0 oz. | .005″ | .006″ |
| 3.0+ oz. | .006″ | .007″ |
Minimum Feature Spacing :
| Start Cu Foil weight | Internal | External |
|---|---|---|
| 0.5 oz. | .003″ | .004″ |
| 1.0 oz. | .005″ | .006″ |
| 2.0 oz. | .006″ | .0075″ |
| 3.0+ oz. | .007″ | .009″ |
- Max. Aspect Ratio: 10 to 1
- Min. hole size tolerance (plated):+ .003″ Min hole size tolerance (unplated): +.0015″
- Min. drilled hole size: 6 mil; maximum hole size: 250 mil
- Min. annular plane clearance of drilled hole: .010″
- Min. internal pad size to drill hole size: +.012″
- Min. external pad size to drill hole size: +.010″
- Dual Access Testing – Universal grid
- Net list Testing (Gerber – extracted/IPC- D-356)
- Fixtureless Testing for Proto/Small Volume
- Impedance Testing (Polar CITS-500) Impedance Tolerance: + /- 5%
- Min. Continuity Test: 10 Ohm
- Max Isolation Test:10 M Ohm
- Voltage: 10 – 100 VDC
- Fine Pitch Testing:
- Min. SMD Pitch (fixtureless): .012″
- Min. BGA Pitch (fixture): 1 mm (.0394)
- HASL – Hot Air Solder Level
- Lead Free Hot Air Level
- ENIG – Electroless Nickel / Immersion Gold
- Electroless Palladium
- Electrolytic Hard Gold over Electrolytic Nickel
- Electrolytic Soft gold and Electrolytic Nickel
- Immersion Tin
- Immersion Silver
- OSP – Organic Solderable Preservative/HT-Organic Solderable
- Carbon ink – switch pads
- Spray-coated Photo-imageable solder mask
- Screened epoxy solder mask
- Screened UV-curable via plugging
- Peelable mask with stencil
- Min. web thickness: .004
- Min. solder mask clearance : .0025
- Conductive
- Non-Conductive
- Edge milling
- Hard-tool Pierce and /or Blank
- Edge beveling
- Minimum slot width:.020″
- Min. inside radius (milled): .015″
- Min. Distance of Plated Hole to internal Trace or Plane .0075″
- Min. Distance of Non-Plated Hole to internal Trace or Plane: Internal: .0075″, External .006″
- Standard finished Minimum Annular Ring is .001″, if not specified.
- Min. Pad to Drill Hole Size: Internal .010″, External .008″
- Min. Plane Clearance to Drill Hole: .020″
- Min. Drilled Hole Size: .008″