Core Competence
- Advanced Technology PCB Solutions
- High Frequency & High Speed Solutions
- Advanced RF & Microwave Solutions
- Thermal Management Expertise
- High Performance Material Selection
- Advanced Digital & RF Engineering
- Quick turn Protos & Productions
Surface Finish Options
- Hot Air Solder Level (HASL)
- Lead Free Hot Air Level (LFHASL)
- Organic Surface Preservative (OSP)
- Electroless Nickel Immersion Gold
- Immersion Silver
- Immersion Tin
- Electrolytic Hard / Soft Gold
Enabling Technologies
- Selective Surface Finishes
- Back-drilling
- Positive Etch-back Boards
- Hybrid Multi-layers
- Teflon
- Heat Sink / Metal Core
- Blind & Buried Vias
Rigid PCB Capabilities Overview
- Up to 12-14 Layer Multilayer
- Lines / Spaces: 4/4 Mils
- Blind & Buried Vias
- Panel Thickness: .015 to.250”
- Smallest Drill Size: 6 Mils
- Via In Pad with Fill & Plate Options
- IPC Class 2 & 3 Compliant
Enabling Technologies
- 12-14 Layer
- 4/4 Line & Space
- Edge Plating & Castellation
- Blind & Buried Vias
- 6 Mil Mechanical Drilling
- Sequential Lamination
- Controlled Impedance – With TDR
Certifications
- ISO 9001:2015 Certified
- Fabrication to IPC Class 2 & 3
- ITAR Registered
- PPAP Repotting for Automotive Parts
- UL Certified File # E102394
- Minority Business Certified CH399
- Advanced Technology PCB Solutions